 | Certificate n°:
TW-HSPM-1270 | Issued: | 2008/05/13 |
DB Registration n°:
HC-IECQ ECCB 08.0234 | Revision: | 1 |
| Expiration: | 2011/05/12 |
| Status: | Superseded |
IECQ Certificate of Hazardous Substance Process Management (HSPM)
applicable to the European Directive 2002/95/EC ("RoHS") requirements and other identified Hazardous Substances.The Supervising Inspectorate (ECCB) and the Underwriters Laboratories Inc. Certify thatWINBOND ELECTRONICS CORP. No. 4, Creation Road III,
Hsinchu Science Park,
300, Taiwan
Has developed and implemented Hazardous Substance Process Management, procedures and related processes in compliance with the applicable requirements for HSPM organization approval which is in accordance with the Basic Rules IECQ-01 and Rules of Procedure QC 001002-5 "IECQ Hazardous Substances Process Management" of the IEC Quality Assessment System for Electronic Components (IECQ), and with respect to the Specification QC 080000. |
This Certification is applicable to
all electronic components and related materials and processes for the |
Design, fabrication and test of integrated circuits in wafer form and test of assembled integrated circuits. |
Issued by Certification Authorities: |
| |
Underwriters Laboratories Inc.
Restrictive Substances Compliance Solutions
464 New Boston Road
Candia, NH 03034
United States of America | Electronic Components Certification Board
PO BOX 9041
MIDLAND, Texas 79705
United States of America |
|
The validity of this certificate is maintained through on-going surveillance inspections.
Note: This certificate is valid only in conjunction with the approval document(s). This approval and this
certificate may be suspended or withdrawn in accordance with the Rules of Procedure of the IECQ. This
certificate remains the property of the body which granted it.
(*)HSPM: Hazardous Substance Process Management |